Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084871 | Redistribution layer enhancement to improve reliability of wafer level packaging | S. Kaysar Rahim, Tiao Zhou, Viren Khandekar, Yong Li Xu | 2011-12-27 |
| 7960256 | Use of CL2 and/or HCL during silicon epitaxial film formation | Zhiyuan Ye, Yihwan Kim, Xiaowei Li, Ali Zojaji, Nicholas C. Dalida +2 more | 2011-06-14 |
| 7871469 | Method for fabricating waveguides | Dan Maydan | 2011-01-18 |