Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084871 | Redistribution layer enhancement to improve reliability of wafer level packaging | S. Kaysar Rahim, Tiao Zhou, Arkadii V. Samoilov, Viren Khandekar | 2011-12-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084871 | Redistribution layer enhancement to improve reliability of wafer level packaging | S. Kaysar Rahim, Tiao Zhou, Arkadii V. Samoilov, Viren Khandekar | 2011-12-27 |