Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989916 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | John Tang, Xiang Yin Zeng, Ding Hai | 2011-08-02 |
| 7980865 | Substrate with raised edge pads | Wei Shi, Daoqiang Lu, Qing Zhou | 2011-07-19 |
| 7939922 | Forming compliant contact pads for semiconductor packages | Qing Zhou, Wei Shi, Daoqiang Lu | 2011-05-10 |