Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8063482 | Heat spreader as mechanical reinforcement for ultra-thin die | — | 2011-11-22 |
| 8012808 | Integrated micro-channels for 3D through silicon architectures | Wei Shi, Yiqun Bai, Qing Zhou, Jianqqi He | 2011-09-06 |
| 7980865 | Substrate with raised edge pads | Wei Shi, Qing Zhou, Jiangqi He | 2011-07-19 |
| 7945127 | Electrically pluggable optical interconnect | — | 2011-05-17 |
| 7939922 | Forming compliant contact pads for semiconductor packages | Qing Zhou, Wei Shi, Jiangqi He | 2011-05-10 |
| 7897486 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Christopher L. Rumer, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2011-03-01 |