Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012808 | Integrated micro-channels for 3D through silicon architectures | Wei Shi, Daoqiang Lu, Yiqun Bai, Jianqqi He | 2011-09-06 |
| 7980865 | Substrate with raised edge pads | Wei Shi, Daoqiang Lu, Jiangqi He | 2011-07-19 |
| 7939922 | Forming compliant contact pads for semiconductor packages | Wei Shi, Daoqiang Lu, Jiangqi He | 2011-05-10 |