Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989916 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | John Tang, Jiangqi He, Ding Hai | 2011-08-02 |
| 7981726 | Copper plating connection for multi-die stack in substrate package | John Tang, Henry Xu, Jianmin Li | 2011-07-19 |