Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084867 | Apparatus, system, and method for wireless connection in integrated circuit packages | Jiamiao Tang, Shinichi Sakamoto | 2011-12-27 |
| 7981726 | Copper plating connection for multi-die stack in substrate package | John Tang, Jianmin Li, Xiang Yin Zeng | 2011-07-19 |