Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7951648 | Chip-level underfill method of manufacture | Claudius Feger | 2011-05-31 |
| 7883919 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more | 2011-02-08 |