Issued Patents 2011
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7916483 | Open flow cold plate for liquid cooled electronic packages | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-03-29 |
| 7905096 | Dehumidifying and re-humidifying air cooling for an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-03-15 |
| 7907406 | System and method for standby mode cooling of a liquid-cooled electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-03-15 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling | Bruce K. Furman, Paul A. Lauro, Yves Martin, Roger R. Schmidt, Da-Yuan Shih +2 more | 2011-03-01 |
| 7885070 | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-02-08 |
| 7885074 | Direct jet impingement-assisted thermosyphon cooling apparatus and method | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-02-08 |
| 7878007 | Monitoring method and system for determining airflow rate through and heat removal rate of an air-conditioning unit | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-02-01 |