Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084864 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-12-27 |
| 8021943 | Simultaneously formed isolation trench and through-box contact for silicon-on-insulator technology | Alan B. Botula, BethAnn Rainey | 2011-09-20 |
| 8003536 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-08-23 |