Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030208 | Bonding method for through-silicon-via based 3D wafer stacking | Chi Kuen Vincent Leung, Peng SUN, Xunqing Shi | 2011-10-04 |
| 8031484 | IC packages with internal heat dissipation structures | HuiLi Fu, Man Lung Sham | 2011-10-04 |
| 8011237 | Piezoelectric module for energy harvesting, such as in a tire pressure monitoring system | Ziyang Gao, Man Lung Sham | 2011-09-06 |
| 7902727 | Apparatus and method for generating electricity using piezoelectric material | Man Lung Sham, Ziyang Gao, Tung Ching Lui | 2011-03-08 |
| 7879438 | Substrate warpage-reducing structure | Jyh-Rong Lin, Bin Xie, Yeung Yeung, Xunqing Shi | 2011-02-01 |