HF

HuiLi Fu

HL Hong Kong Applied Science And Technology Research Institute Company Limited: 1 patents #33 of 94Top 40%
Overall (2011): #282,300 of 364,097Top 80%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8031484 IC packages with internal heat dissipation structures Man Lung Sham, Chang Hwa Chung 2011-10-04