CL

Chi Kuen Vincent Leung

HL Hong Kong Applied Science And Technology Research Institute Company Limited: 1 patents #33 of 94Top 40%
📍 Sha Tin, CN: #27 of 157 inventorsTop 20%
Overall (2011): #332,981 of 364,097Top 95%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8030208 Bonding method for through-silicon-via based 3D wafer stacking Peng SUN, Xunqing Shi, Chang Hwa Chung 2011-10-04