Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030208 | Bonding method for through-silicon-via based 3D wafer stacking | Chi Kuen Vincent Leung, Peng SUN, Chang Hwa Chung | 2011-10-04 |
| 7879438 | Substrate warpage-reducing structure | Jyh-Rong Lin, Bin Xie, Yeung Yeung, Chang Hwa Chung | 2011-02-01 |