Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084130 | Epoxy resin molding material for sealing and electronic component device | Mitsuyoshi Hamada, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa | 2011-12-27 |
| 8044524 | Adhesive for connection of circuit member and semiconductor device using the same | — | 2011-10-25 |
| 8034659 | Production method of semiconductor device and bonding film | Masaaki Yasuda, Keiichi Hatakeyama, Tetsuya Enomoto | 2011-10-11 |
| 7928627 | Laminated core and method for manufacturing the same | Iwao Myojin, Akinori Hoshino, Masafumi Sakuma, Hiroyuki Yamamoto, Haruji Suzuki | 2011-04-19 |
| 7879445 | Adhesive for bonding circuit members, circuit board and process for its production | Itsuo Watanabe, Kenzo Takemura, Kazuhiro Isaka, Osamu Watanabe, Kazuyoshi Kojima | 2011-02-01 |