Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071465 | Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device | Yuuki Nakamura | 2011-12-06 |
| 8034659 | Production method of semiconductor device and bonding film | Akira Nagai, Masaaki Yasuda, Tetsuya Enomoto | 2011-10-11 |
| 7947779 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2011-05-24 |