Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017444 | Adhesive sheet, semiconductor device, and process for producing semiconductor device | Michio Mashino, Michio Uruno, Tetsuro Iwakura | 2011-09-13 |
| 8012580 | Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device | Keisuke Ookubo | 2011-09-06 |
| 8003207 | Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device | Keisuke Ookubo | 2011-08-23 |
| 7968195 | Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler | Michio Mashino, Michio Uruno | 2011-06-28 |
| 7968194 | Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler | Michio Mashino, Michio Uruno | 2011-06-28 |
| 7947779 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami, Masao Suzuki +6 more | 2011-05-24 |
| 7875500 | Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support | Michio Mashino, Michio Uruno | 2011-01-25 |