Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017444 | Adhesive sheet, semiconductor device, and process for producing semiconductor device | Teiichi Inada, Michio Uruno, Tetsuro Iwakura | 2011-09-13 |
| 7968194 | Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler | Teiichi Inada, Michio Uruno | 2011-06-28 |
| 7968195 | Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler | Teiichi Inada, Michio Uruno | 2011-06-28 |
| 7875500 | Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support | Teiichi Inada, Michio Uruno | 2011-01-25 |