Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084130 | Epoxy resin molding material for sealing and electronic component device | Akira Nagai, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa | 2011-12-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084130 | Epoxy resin molding material for sealing and electronic component device | Akira Nagai, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa | 2011-12-27 |