Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7879445 | Adhesive for bonding circuit members, circuit board and process for its production | Itsuo Watanabe, Kenzo Takemura, Akira Nagai, Osamu Watanabe, Kazuyoshi Kojima | 2011-02-01 |