Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8002860 | CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive | Naoyuki Koyama, Kouji Haga, Masato Yoshida, Keizou Hirai, Toranosuke Ashizawa | 2011-08-23 |