Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8075800 | Polishing slurry and polishing method | Naoyuki Koyama, Youichi Machii, Masato Yoshida, Masato Fukasawa | 2011-12-13 |
| 8002860 | CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive | Naoyuki Koyama, Kouji Haga, Masato Yoshida, Keizou Hirai, Youiti Machii | 2011-08-23 |
| 7963825 | Abrasive, method of polishing target member and process for producing semiconductor device | Masato Yoshida, Hiroki Terazaki, Yuuto Ootuki, Yasushi Kurata, Jun Matsuzawa +1 more | 2011-06-21 |
| 7887609 | Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same | Hiroshi Ono, Yasuo Kamigata | 2011-02-15 |
| 7871308 | Abrasive, method of polishing target member and process for producing semiconductor device | Masato Yoshida, Hiroki Terazaki, Yuuto Ootuki, Yasushi Kurata, Jun Matsuzawa +1 more | 2011-01-18 |
| 7867303 | Cerium oxide abrasive and method of polishing substrates | Masato Yoshida, Hiroki Terazaki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno +1 more | 2011-01-11 |