Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8028402 | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof | Hidehiro Nakamura, Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Tetsuya Enomoto +1 more | 2011-10-04 |
| 7964289 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof | Kenji Takai, Kenichi Kamiyama, Katsuyuki Masuda, Kiyoshi Hasegawa | 2011-06-21 |
| 7862889 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | Kenji Takai, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa, Koji Morita +2 more | 2011-01-04 |