Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7964289 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Kiyoshi Hasegawa | 2011-06-21 |
| 7947332 | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board | Nozomu Takano, Kazumasa Takeuchi, Masashi Tanaka, Kazuhito Obata, Yuuji Ooyama +1 more | 2011-05-24 |
| 7871694 | Prepreg, metal-clad laminate and printed circuit board using same | Kazumasa Takeuchi, Makoto Yanagida, Masaki Yamaguchi | 2011-01-18 |
| 7862889 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa +2 more | 2011-01-04 |