Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7964289 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Katsuyuki Masuda | 2011-06-21 |
| 7862889 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa +2 more | 2011-01-04 |