Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8028402 | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof | Hidehiro Nakamura, Akishi Nakaso, Fumio Inoue, Tetsuya Enomoto, Norio Moriike +1 more | 2011-10-04 |