Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017969 | LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same | Bily Wang, Shih-Yu Wu | 2011-09-13 |
| 8002436 | LED chip package structure using a substrate as a lampshade and method for making the same | Bily Wang, Shih-Yu Wu | 2011-08-23 |
| 7951621 | LED chip package structure with high-efficiency light-emitting effect and method of packaging the same | Bily Wang, Jonnie Chuang | 2011-05-31 |
| 7923745 | LED chip package structure with high-efficiency light-emitting effect and method of packaging the same | Bily Wang, Jonnie Chuang | 2011-04-12 |