Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003413 | Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same | Bily Wang, Chia-Hung Chen | 2011-08-23 |
| 7951621 | LED chip package structure with high-efficiency light-emitting effect and method of packaging the same | Bily Wang, Wen-Kuei Wu | 2011-05-31 |
| 7923745 | LED chip package structure with high-efficiency light-emitting effect and method of packaging the same | Bily Wang, Wen-Kuei Wu | 2011-04-12 |