Issued Patents 2011
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8079737 | Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency | Ping-Chou Yang, Yu-Jen Cheng | 2011-12-20 |
| 8053961 | Color-mixture display unit and image display apparatus using the same | Hui-Chung Lin | 2011-11-08 |
| 8053904 | Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same | HUNG-CHOU YANG, JENG-RU CHANG | 2011-11-08 |
| 8053885 | Wafer level vertical diode package structure and method for making the same | SUNG-YI HSIAO, Jack Chen | 2011-11-08 |
| 8031930 | Testing system and testing method for inspecting electonic devices | Kuei-Pao Chen, Hsin-Cheng Chen, Ming-Hao Chou | 2011-10-04 |
| D645421 | LED base | SUNG-YI HSIAO, Jack Chen | 2011-09-20 |
| 8017969 | LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same | Shih-Yu Wu, Wen-Kuei Wu | 2011-09-13 |
| 8003413 | Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same | Jonnie Chuang, Chia-Hung Chen | 2011-08-23 |
| 8002436 | LED chip package structure using a substrate as a lampshade and method for making the same | Shih-Yu Wu, Wen-Kuei Wu | 2011-08-23 |
| 7964420 | LED chip package structure with an embedded ESD function and method for manufacturing the same | Ping-Chou Yang, Jia Chen | 2011-06-21 |
| 7951621 | LED chip package structure with high-efficiency light-emitting effect and method of packaging the same | Jonnie Chuang, Wen-Kuei Wu | 2011-05-31 |
| 7923747 | Wafer level LED package structure and method for making the same | SUNG-YI HSIAO, Jack Chen | 2011-04-12 |
| 7923745 | LED chip package structure with high-efficiency light-emitting effect and method of packaging the same | Jonnie Chuang, Wen-Kuei Wu | 2011-04-12 |
| 7898663 | Uniform light generating system for testing an image-sensing device and method of using the same | Kuei-Pao Chen, Chih-Ming Wang | 2011-03-01 |
| 7876593 | LED chip package structure with an embedded ESD function and method for manufacturing the same | Ping-Chou Yang, Jia Chen | 2011-01-25 |