Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017969 | LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same | Bily Wang, Wen-Kuei Wu | 2011-09-13 |
| 8002436 | LED chip package structure using a substrate as a lampshade and method for making the same | Bily Wang, Wen-Kuei Wu | 2011-08-23 |