Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072044 | Semiconductor die containing lateral edge shapes and textures | Michael D. Gruenhagen | 2011-12-06 |
| 8058732 | Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same | Michael D. Gruenhagen, Suku Kim, James J. Murphy, Ihsiu Ho, Eddy Tjhia +2 more | 2011-11-15 |