Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7999394 | Void reduction in indium thermal interface material | Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev | 2011-08-16 |
| 7923850 | Semiconductor chip with solder joint protection ring | Mohammad Khan, Jun Zhai, Ranjit Gannamani | 2011-04-12 |