Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8034662 | Thermal interface material with support structure | Gamal Refai-Ahmed, Yizhang Yang, Bryan Black | 2011-10-11 |
| 7999394 | Void reduction in indium thermal interface material | Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Raj N. Master | 2011-08-16 |
| 7911791 | Heat sink for a circuit device | Gamal Refai-Ahmed | 2011-03-22 |