Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017434 | Semiconductor chip package fixture | Kevin Lim, Azlina N. Nayan, Kee Hean Keok, Soon Tatt Ow Yong | 2011-09-13 |
| 7999394 | Void reduction in indium thermal interface material | Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master | 2011-08-16 |