Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008133 | Chip package with channel stiffener frame | Eric Tosaya, Chia-Ken Leong, Tom Ley | 2011-08-30 |
| 7989956 | Interconnects with improved electromigration reliability | Fei Wang | 2011-08-02 |
| 7923850 | Semiconductor chip with solder joint protection ring | Mohammad Khan, Ranjit Gannamani, Raj N. Master | 2011-04-12 |