Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7906857 | Molded integrated circuit package and method of forming a molded integrated circuit package | Lan H. Hoang, Laurene Yip | 2011-03-15 |
| 7863092 | Low cost bumping and bonding method for stacked die | Arifur Rahman | 2011-01-04 |