Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7906857 | Molded integrated circuit package and method of forming a molded integrated circuit package | Raghunandan Chaware, Laurene Yip | 2011-03-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7906857 | Molded integrated circuit package and method of forming a molded integrated circuit package | Raghunandan Chaware, Laurene Yip | 2011-03-15 |