LY

Laurene Yip

AM AMD: 1 patents #237 of 913Top 30%
📍 San Francisco, CA: #748 of 2,197 inventorsTop 35%
🗺 California: #14,783 of 41,698 inventorsTop 40%
Overall (2011): #235,925 of 364,097Top 65%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7906857 Molded integrated circuit package and method of forming a molded integrated circuit package Lan H. Hoang, Raghunandan Chaware 2011-03-15