Issued Patents 2011
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8082537 | Method and apparatus for implementing spatially programmable through die vias in an integrated circuit | — | 2011-12-20 |
| 8063654 | Apparatus and method for testing of stacked die structure | Hong-Tsz Pan, Bang-Thu Nguyen | 2011-11-22 |
| 8058707 | Semiconductor devices having redundant through-die vias and methods of fabricating the same | Stephen M. Trimberger | 2011-11-15 |
| 7998853 | Semiconductor device with through substrate vias | — | 2011-08-16 |
| 7989959 | Method of forming stacked-die integrated circuit | — | 2011-08-02 |
| 7973555 | Configuration interface to stacked FPGA | Stephen M. Trimberger | 2011-07-05 |
| 7968375 | Method and apparatus for integrating capacitors in stacked integrated circuits | Stephen M. Trimberger | 2011-06-28 |
| 7930661 | Software model for a hybrid stacked field programmable gate array | Stephen M. Trimberger, Bernard J. New | 2011-04-19 |
| 7884398 | Floating gate field effect transistors for chemical and/or biological sensing | Kalle Levon, Tsunehiro Sai, Ben Zhao | 2011-02-08 |
| 7863092 | Low cost bumping and bonding method for stacked die | Raghunandan Chaware | 2011-01-04 |