Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6917109 | Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device | Water Lur, David Lee, Kuang-Chih Wang | 2005-07-12 |
| 6905938 | Method of forming interconnect structure with low dielectric constant | Chih-Chien Liu | 2005-06-14 |
| 6858487 | Method of manufacturing a semiconductor device | Water Lur | 2005-02-22 |