Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977217 | Aluminum-filled via structure with barrier layer | Mira Ben-Tzur, Gorley Lau, Ivan Petrov Ivanov, FENG-YUEN DAI | 2005-12-20 |
| 6890859 | Methods of forming semiconductor structures having reduced defects, and articles and devices formed thereby | Hanna Bamnolker, Saurabu Dutta Chowdhury, Krishnaswamy Ramkumar | 2005-05-10 |