Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977217 | Aluminum-filled via structure with barrier layer | Mira Ben-Tzur, Ivan Petrov Ivanov, FENG-YUEN DAI, Chan-Lon Yang | 2005-12-20 |
| 6969448 | Method for forming a metallization structure in an integrated circuit | — | 2005-11-29 |
| 6906421 | Method of forming a low resistivity Ti-containing interconnect and semiconductor device comprising the same | Ende Shan, Anthony Chung | 2005-06-14 |