Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977217 | Aluminum-filled via structure with barrier layer | Gorley Lau, Ivan Petrov Ivanov, FENG-YUEN DAI, Chan-Lon Yang | 2005-12-20 |
| 6939792 | Low-k dielectric layer with overlying adhesion layer | Maryam Jahangiri | 2005-09-06 |
| 6911395 | Method of making borderless contacts in an integrated circuit | Jiamin Qiao, Prabhuram Gopalan | 2005-06-28 |
| 6903002 | Low-k dielectric layer with air gaps | Krishnaswamy Ramkumar, Christopher A. Seams, Thurman J. Rodgers | 2005-06-07 |
| 6844235 | Reticle repeater monitor wafer and method for verifying reticles | Christopher Michael Jones, Allen Fung | 2005-01-18 |
| 6841878 | Integrated circuit with improved RC delay | Krishnaswamy Ramkumar, Alain Blosse, Fuad Badrieh | 2005-01-11 |