HM

Hidetoshi Maesato

TC Tokyo Tungsten Co.: 1 patents #1 of 8Top 15%
📍 Yamagata, JP: #10 of 42 inventorsTop 25%
Overall (2005): #189,370 of 245,428Top 80%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6926861 Semiconductor package and method for producing heat-radiating substrate for it Norio Hirayama, Mitsuo Osada, Akira Ichida, Yoshinari Amano, Kiyoshi Asai +2 more 2005-08-09