AI

Akira Ichida

TC Tokyo Tungsten Co.: 1 patents #1 of 8Top 15%
📍 Toyama, JP: #33 of 107 inventorsTop 35%
Overall (2005): #242,389 of 245,428Top 100%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6926861 Semiconductor package and method for producing heat-radiating substrate for it Norio Hirayama, Mitsuo Osada, Yoshinari Amano, Kiyoshi Asai, Hidetoshi Maesato +2 more 2005-08-09