MO

Mitsuo Osada

TC Tokyo Tungsten Co.: 1 patents #1 of 8Top 15%
📍 Kasai, JP: #181 of 567 inventorsTop 35%
Overall (2005): #135,612 of 245,428Top 60%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6926861 Semiconductor package and method for producing heat-radiating substrate for it Norio Hirayama, Akira Ichida, Yoshinari Amano, Kiyoshi Asai, Hidetoshi Maesato +2 more 2005-08-09