Issued Patents 2005
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6965158 | Multi-layer substrates and fabrication processes | Belgacem Haba | 2005-11-15 |
| 6939735 | Microelectronic assembly formation with releasable leads | Mitchell Koblis | 2005-09-06 |
| 6938338 | Method of making an electronic contact | Joseph Fjelstad, Thomas H. DiStefano, James Zaccardi, A. Christian Walton | 2005-09-06 |
| 6927095 | Low cost and compliant microelectronic packages for high I/O and fine pitch | — | 2005-08-09 |
| 6921713 | Semiconductor chip package with interconnect structure | Belgacem Haba | 2005-07-26 |
| 6897090 | Method of making a compliant integrated circuit package | Thomas H. DiStefano, Konstantine Karavakis, Craig Mitchell | 2005-05-24 |
| 6891255 | Microelectronic packages having an array of resilient leads | Bruce M. McWilliams | 2005-05-10 |
| 6870272 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Craig Mitchell, Thomas H. DiStefano | 2005-03-22 |
| 6849953 | Microelectronic assemblies with composite conductive elements | — | 2005-02-01 |
| 6848173 | Microelectric packages having deformed bonded leads and methods therefor | Joseph Fjelstad, Masud Beroz, Belgacem Haba | 2005-02-01 |
| 6846700 | Method of fabricating microelectronic connections using masses of fusible material | — | 2005-01-25 |