Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6946859 | Probe structures using clamped substrates with compliant interconnectors | Tom Nguyen | 2005-09-20 |
| 6924654 | Structures for testing circuits and methods for fabricating the structures | Tom Nguyen | 2005-08-02 |
| 6897090 | Method of making a compliant integrated circuit package | Thomas H. DiStefano, Craig Mitchell, John W. Smith | 2005-05-24 |
| 6847101 | Microelectronic package having a compliant layer with bumped protrusions | Joseph Fjelstad | 2005-01-25 |
| 6847107 | Image forming apparatus with improved transfer efficiency | Joseph Fjelstad | 2005-01-25 |