Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958546 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Cheng-Yu Chu, Kuo-Wei Lin, Yang-Tung Fran, Chiou-Shian Peng | 2005-10-25 |
| 6936923 | Method to form very a fine pitch solder bump using methods of electroplating | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan +1 more | 2005-08-30 |