Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977349 | Method for manufacturing wiring circuit boards with bumps and method for forming bumps | Yutaka Kaneda, Keiichi Naito | 2005-12-20 |
| 6912779 | Method of manufacturing flexible wiring board | Keiichi Naitoh, Masahiro Watanabe | 2005-07-05 |
| 6840430 | Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards | Hideyuki Kurita, Masanao Watanabe, Mitsuhiro Fukuda, Yukio Anzai | 2005-01-11 |